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1.02 inch Mini flexible e-paper display ACF Thermal Compression Bonding, GDEW0102I4FC
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1.02 inch Mini flexible e-paper display ACF Thermal Compression Bonding, GDEW0102I4FC

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1.02 Inch / Flexible / 30 Pin / Support Partial refresh

This is a 1.02 inch flexible E ink Epaper display panel, 128x80 resolution, 30 pins, connecting to the PCB board through ACF Thermal Compression Bonding, which ensure the ultra-thin characteristics of the finished product. SPI interface, Support partial refresh. It's IC Driver is UC8175.

In view of so many advantages: ultra low power consumption, ultra wide viewing angle, GDEW0102I4FC is a very good choice for applications like smart tags, smart watch and other related products.

Tips: Usually, the e-paper display is mostly plugged into the FPC, but this 1.02 inch display is a ACF Thermal Compression bonding method, and the gold finger of the FPC is facing down when the display side is facing up. We can offer the adapter board for test.

 



Features:
Mini flexible e-ink e-paper display, Support small bending

ACF (FPC + PCB) Thermal Compression Bonding
Ultra-thin, not fragile
Support Partial refresh

SPI interface, 30 pin.
Come with helpful development resources and manual
The I2C signal master interface to read built-in temperature sensor.





Development platform available:

STM32 Arduino UNO ESP8266

 
Raspberry Pi ESP32  

 

 

 

 

 

Keyword:
1.02 inch Mini flexible e-paper display Pressed-on FPC
We could not find any corresponding parameters, please add them to the properties table

 

Parameters:

Part Number

GDEW0102I4FC

Features

Flexible

IC Driver

UC8175

Resolution

128x80

Outline Size(mm)

18.6x32.57x0.3

Active Size(mm)

14x21.76

Pixel Pitch(mm)

0.175x0.17

Operating Temp.

0℃~50℃

Storage Temp.

-25℃~70℃

Connector

30 Pin

Max Grayscale

2

Color

Black,White

 

Drawing Picture:

 

 

 

 

 

Related information download

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2.0M
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